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TSMC 3Q26 Earnings & 4Q26 Guidance Breakdown: $46.72B Revenue, 66.4% Gross Margin, 8% N2 Share & $60B-$64B CapEx

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As of 2026.10.28 | Research & Disclosure Note: This article is a personal research memo written by the author of Deep Growth Investing based on the official earnings releases and regulatory filings cited inline (figures calculated by the author from primary tables are labeled Author calculation). As of the writing date, I do not hold shares or positions in any of the companies discussed. This post is for informational and personal record-keeping purposes only and does not constitute investment advice or a solicitation to buy or sell any security.

When I review TSMC's quarterly numbers, I focus less on headline revenue beats and more on three underlying operational gauges: gross margin absorption during a new node ramp, wafer revenue mix across High-Performance Computing (HPC) and leading-edge nodes, and free cash flow coverage of capital expenditures. In its 3Q26 financial release, management report, presentation, and earnings call transcript [1][2][3][4], TSMC reported 3Q26 revenue of US$46.72 billion and guided 4Q26 revenue to US$52.3B–$54.3B.

3-Line Summary (As of 2026.10.28):
  • 3Q26 Revenue & Margin: Revenue reached US$46.72B (+16.2% QoQ, +41.2% YoY), exceeding the top end of prior guidance ($45.8B); Gross Margin was 66.4% (-1.3%p QoQ from 67.7% due to initial 2nm dilution, +6.9%p YoY, inside the 65%–67% guidance band); Operating Margin was 58.7% (vs. 60.3% in 2Q26 and 50.6% in 3Q25).
  • 4Q26 & Full-Year Guidance: 4Q26 revenue is guided to US$52.3B–$54.3B ($53.3B midpoint, +14% QoQ) with Gross Margin at 65%–67% (66.0% midpoint, -40bp QoQ). Full-year 2026 USD revenue growth guidance was raised from above 40% to approaching mid-40% (~44%).
  • HPC, 2nm (N2) & CapEx: HPC reached 68% of revenue (+22% QoQ), advanced nodes (≤7nm) reached 79% of wafer revenue (3nm 33%, 5nm 28%, and 2nm jumped from 3% to 8%), and the 2026 CapEx budget was maintained at US$60B–$64B (with 3Q26 FCF positive at NT$476.56B).
TSMC 3Q26 Margin Trend and Wafer Revenue Share by Node

1. 3Q26 Earnings & 4Q26 Guidance: Absorbing N2 Ramp and Overseas Fab Dilution

In 3Q26, TSMC delivered US$46.72B in revenue (+16.2% QoQ, +41.2% YoY), beating the upper bound of its prior guidance ($45.8B) [1][3]. Gross margin came in at 66.4%, down 1.3%p sequentially from 67.7% in 2Q26 as initial 2nm (N2) mass-production dilution took effect, but up 6.9%p YoY and comfortably within the 65%–67% guidance range [2].

Metric 3Q25 2Q26 3Q26 Actual 4Q26 Official Guidance
Revenue (USD) $33.10B $40.22B $46.72B (+16.2% QoQ / +41.2% YoY) $52.3B – $54.3B ($53.3B mid, +14% QoQ)
Gross Margin (%) 59.5% 67.7% 66.4% (-1.3%p QoQ / +6.9%p YoY) 65.0% – 67.0% (66.0% mid, -40bp QoQ)
Operating Margin (%) 50.6% 60.3% 58.7% (vs. 60.3% in 2Q26 and 50.6% in 3Q25) 56.0% – 58.0%

On the 3Q26 conference call [4], management guided that overseas fab ramps will dilute gross margin by roughly 2%p in 2026 and 3–4%p in subsequent years. Even after absorbing N2 ramp dilution and overseas fab costs, TSMC expects 4Q26 gross margin to hold a 66.0% midpoint.

2. Platform & Process Node Breakdown: HPC 68%, N2 Ramps to 8%

Looking at revenue by platform and wafer revenue by node [3]:

  • HPC (High-Performance Computing): Accounted for 68% of total 3Q26 revenue (up from 66% in 2Q26), growing +22% QoQ.
  • Smartphone: Accounted for 21% of revenue (down from 22% in 2Q26), growing +10% QoQ.
  • Advanced Nodes (≤7nm): Reached 79% of total wafer revenue—led by 3nm at 33%, 5nm at 28%, 7nm at 10%, and 2nm (N2) jumping from 3% in 2Q26 to 8% in 3Q26.

3. CapEx Budget ($60B–$64B) & Free Cash Flow Coverage

TSMC maintained its 2026 annual capital expenditure budget at US$60 billion to US$64 billion [4]. Through the first three quarters of 2026, cumulative CapEx reached US$40.64B (with US$13.84B spent in 3Q26 alone) [3]. In NTD terms, 3Q26 operating cash flow was NT$919.77B against capital expenditures of NT$443.21B, leaving positive quarterly free cash flow of NT$476.56B [2]. Management also noted that both leading-edge foundry wafer supply and CoWoS advanced packaging capacity remain tight relative to AI customer demand [4].

Primary Sources

  1. TSMC 3Q26 Earnings Release PDF
  2. TSMC 3Q26 Management Report PDF
  3. TSMC 3Q26 Presentation (English) PDF
  4. TSMC 3Q26 Earnings Call Transcript PDF